Author(s): V Sarath Teja, A Ramakrishna, Dr. G V S N R Ratnakara Rao
Published in: International Journal of Engineering Research & Technology
License: This work is licensed under a Creative Commons Attribution 4.0 International License.
Volume/Issue: Vol. 3 - Issue 8 (August - 2014)
the heat extraction problem is becoming an important factor in the development of micro-electronics. The microchannel heat sink is designed for electronic chips that could be effectively cooled by means of forced convection, by water flowing through the microchannels. This paper presents a Computational Fluid Dynamics (CFD) flow simulation modeling, where water is made to flow across different cross-sectional microchannel heat sinks placed on heat source. The flow simulation of water and convective heat transfer are carried by using commercial software “SOLID WORKS FLOW SIMULATION”. In the CFD process stacked microchannels of various cross-sections viz., rectangular, triangular, pentagonal and circular are designed, then by defining the computational domain, boundary conditions as inlet mass flow (1e-5 kg/s),outlet pressure ( static pressure) and heat flux(750w/cm2) and by considering the parallel and counter flow direction of water in different cross-sectional microchannels the temperature drop in heat sink, pressure drop across the channels and amount of volumetric heat transfer coefficient are analyzed and compared.
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