Author(s): Rahul K C
Published in: International Journal of Engineering Research & Technology
License: This work is licensed under a Creative Commons Attribution 4.0 International License.
Volume/Issue: Volume. 6 - Issue. 01 , January - 2017
The fluid flow in a channel containing heat sources has been of interest for several decades as the canonical model for electronic chip cooling. Both experimental and numerical methods have been employed to study a wide variety of problems. The powered components are generally idealized as quadrilateral obstacles mounted individually or in arrays to a channel wall with thermal energy transfer to the surroundings. Improved thermal design of electronic components is necessary to reduce hot spots, increase energy throughput, and reduce the failure rate, which is related to the device junction temperature. The convective and radiation heat transfer from the surfaces of the obstacles varies substantially with the geometrical configurations of the chips. The current study involves 2D simulation of mixed convection with surface radiation heat transfer in a channel containing heated obstacles using FLUENT. This study will detail the effects of variations in the obstacle height, width, spacing, and number, along with the Reynolds number, to illustrate important fundamental and practical results. The study would be useful in design of chips for commercial electronics and electrical systems which has efficient heat transfer characteristics.
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